publications

publications by categories in reversed chronological order. generated by jekyll-scholar.

2026

  1. RTL-3D: Timing-aware Tier Partitioning for 3D ICs Using Pre-synthesis Timing Analysis
    Haoyang Xu, Zheng Yang, Zhen Zhuang, and 4 more authors
    IEEE/ACM The Chips to Systems Conference (DAC), 2026
  2. Mixed-structure Double-sided Redistribution Layer Routing for Glass Interposer-based 5.5D ICs
    Haoyang Xu, Zhen Zhuang, Leilei Jin, and 5 more authors
    IEEE/ACM The Chips to Systems Conference (DAC), 2026

2025

  1. Hierarchical Partitioning-Based Inter-Chip Redistribution Layer Routing for Fan-Out Wafer-Level Packaging
    Haoyang Xu, Xing Huang, Zhen Zhuang, and 6 more authors
    IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025
    DOI