publications

publications by categories in reversed chronological order. generated by jekyll-scholar.

2025

  1. Hierarchical Partitioning-Based Inter-Chip Redistribution Layer Routing for Fan-Out Wafer-Level Packaging
    Haoyang Xu, Xing Huang, Zhen Zhuang, and 6 more authors
    IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025
    DOI